A Professionally driven individual with an experience of 7 Years in the Field of Signal Integrity, Hardware Board Design, and Power Integrity analysis. - Experience in Board, Package and Chip level Analysis - Having working Knowledge in Tools Like: ***Board/ Package Level Analysis *** #Signal Integrity: 1. Cadence - Clarity 3D solver ( 3D analysis ) & PowerSI (2.5 Analysis) 2. Cadence - Topology Explorer ( Topology Workbench - Channel simulation) 3. Mentor Graphics - HyperlynxS)I/PI/Thermal 4. Ansys - SIWAVE ( 2.5D analysis) and HFSS- electronic Desktop ( 3D analysis) Power Integrity Tools: 1. Cadence PowerDC - (IR Drop Analysis) , OptmizePI ( AC Analysis) 2. Mentor Graphics - Hyperlynx PI Hands On Experience in Interfaces Like: 1. DDR/DDR2/DDR3 (Signal Integrity Analysis) 2. SPI / I2C/ USART/ DNET (Low Speed Interfaces) 3. SERDES Interfaces : PCIE Gen2, CFP2, SFP++ (Optical Interfaces) Equipments Used: > Oscilloscope (1GHz, 4GHz, 8GHz, 20GHz, 50GHz) > Spectrum Analyzer > Passive Probe, Current Probe, Differential Probe, Customized probe > Thermal Chamber > DC Electronic Load > Digital meter