● Successfully productized over 40 SoCs in various foundries (UMC, Global Foundries, Samsung, TSMC, and INTEL) from 90nm to 3nm technology, with a focus on innovation and direct foundry interfacing, catering to the business value of $10B+. ● Strong hands-on experience in all phases of silicon development, including RTL, validation, DFT, post-silicon debug, and physical design, with cross-domain knowledge of system & software. ● Developed a deep understanding of chips across segments by delivering automotive, DSPs, intelligent wearables, networking, smartphones, RFs, AI, and server-class SoCs, specializing in new products and ground-up architecture. ● Collaborated with cross-geo engineering teams, partnered with multiple business units, and developed strategic customer relationships on delivering products across global locations (US, UK, Germany, Japan, and China). ● Mentored a few startups in chip design and software utilizing AI hardware assets via the INTEL startup program; one of the startups taped out a chip under my guidance. ● Groomed 200+ senior tech leaders industry-wide. Actively mentoring 30+ technical leads across the globe in silicon, system, and software domains in Intel via a mentorship program. Facilitated management training for senior managers and Directors. ● Well-connected with academia as a VSI Executive member with Indian institutions and as an SRC liaison, mentored research projects from Duke University, Texas A&M University, and Georgia Tech University ● Led Quality WG for a 1000+ member org and signed off 20+ SoC tape-outs in client, server, and graphics segments. Collaborated closely with firmware, software, platform, post-silicon, and manufacturing teams to achieve these goals. ● Served as TechBuzz track chair and PESG Innovation Spark Jury member. Held positions as tutorial chair/startup moderator for the VLSID 2022 conference, WIE chair for the VDAT 2022 conference, and invited EDSM guest for the InvestMP 2022 conference. ● A couple of crucial testimonies for AI technical leadership are productizing below SoC from the concept. o Led a team of 100+ members in productizing edge high-performance AI inference and media accelerator server-class products manufactured on TSMC node o Led a small global group in the productization of Qualcomm's first dedicated ultra-low power smart-wearables AI product (Qualcomm® Snapdragon Wear™ 3100), featuring industry-first Near Threshold Computation technology on TSMC node